MonolithIC 3D Inc. Announces Ultra-Scale Integration Scheme

3D IC allows breakthrough redundancy approach. San Jose, CA (PRWEB) December 20, 2011 MonolithIC 3D Inc., a leading 3D-IC company, announced its Ultra-Scale Integration scheme last week. The technology promises to improve the integration level of chips by more than 100x, thereby providing breakthrough performance improvements for supercomputers, servers and many other applications. Ultra-Scale Integration has been a goal of the semiconductor industry since the 1970s. Gene Amdahl notably attempted to develop Wafer-Scale Integration (WSI) as a method of making a supercomputer, starting Tri
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