MonolithIC 3D Inc. Issued 5th Patent on 3D IC Technology

Company's patent portfolio includes 5 issued patents and 50 pending patents in the field of monolithic 3D integrated circuits San Jose, California (PRWEB) November 30, 2011 MonolithIC 3D Inc., a Silicon Valley startup, announced today that it has been issued its fifth patent on monolithic 3D-IC technology. The patent describes techniques to obtain low-cost monolithic 3D logic chips with single crystal silicon transistors and high vertical connectivity. In addition to the 5 issued patents, the company has more than 50 other patents pending, making it one of the key players in the 3D-IC
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