3D-ICs.com Adopts Advertising Model
Incoming revenue to be used to enhance the portal. San Jose, California (PRWEB) November 30, 2011 3D-ICs.com, the premier internet portal aggregating 3D semiconductor technology news, blogs and technical papers, announced that beginning in January, 2012, it will offer advertising opportunities to companies specializing in 3D IC, 3D packaging, and TSV related products and services. 3D integration is in its early stages of market adoption, with high volume manufacturing expected to ramp up in the next few years. According to research from Yole Développement , the market for 3D TSV p
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PRWeb, a leader in online news and press release distribution, has been used by attorneys, law firms and more than 40,000 organizations
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